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HIGH TEMPERATURE LINE

High Temperature Line

"P" Square - Potted Case - Radial Lead.
"B" with solder standoffs.

Leads - 22 AWG Cu/Ni/SnPb Sn96 Hot Solder Dipped.
Voltage - As specified, rated to 200°C


Shell Material
"B" Off White Vectra Per MIL-M-24519C
"P" Black Epoxy Per MIL-M-24325MEC
HT 3030, HT4040, HT5050

Tcc - X7R= -45% max at 200°C
-30% max at 175°C

NPO= 30 ppm/°C max

IR= 25°C= 1000mΩ-μFmin
125°C= 100mΩ-μFmin
150°C= 10mΩ-μFmin
200°C= 1mΩ-μFmin

Case L ±.005 W ±.005 W/B incl. Bump L.S. ±.015 Bump Space
HT2020P .200 .200 --- .200 ---
HT3030P .300 .300 --- .200 ---
HT3030B .300 .300 .330 .200 .100
HT4040P .400 .400 --- .300 ---
HT4040B .400 .400 .430 .300 .200
HT5050P .500 .500 --- .400 ---
HT5050B .500 .500 .530 .400 .300
HT2020 - No solder bumps available. Lead form gives .025" typical offset.
HT3030, 4040, and 5050 - available with .025" solder stand off bumps (B option) for
cleaning and inspection of solder joints.
 

 

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