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Material Specifications
All products meet or exceed the following:
Mechanical
- Dimensions and Configuration:
- As shown on product sheet.
- Case:
- "C" P/N Conformal Epoxy Coating,
- "P" P/N RTV or Epoxy potted in a Diallyl Phthalate or fiberglass shell.
- Lead Material:
- Ni or Sn plated copper. Dimensions as specified 22 or 24 AWG Standard.
- Terminal Strength:
- Per MIL-STD-202, method 211, Test Condition A.
- Marking:
- Per MIL-STD-1 285, depending on space available in the following order of preference: manufacturer I.D. (WCI) capacitance and tolerance, voltage, lot number, size or part number.
Electrical
- Voltage Rating:
- as shown on product sheet.
- Operating Temperature Range:
- Class I and II: -55° to + 125°C
- (higher temperature to 300°C available)
- Class III: Z5U + 10° to 85°C.
- Temperature Characteristics:
- Method 302
- NPO:+ 30ppm/°C
- N2200: 2200ppm/°C
- X7R: ± 15%
- Z5U: + 22%, -56%
- Y5V: + 22%, -82%
- Voltage Characteristics:
- Class I: 0%
- Class II: BR= +15%, -40% with rated voltage
- Class II: BZ= +15%, -45% at 60% rated voltage.
- Class III: see performance curves.
- Capacitance:
- Per MIL-STD-202, Method 305 @ 25°
- NPO<100pF @ 1MHz, 1.2 VRMS Max
- NPO>100pF & X7R @ 1KHz, 1.0 +.2 VRMS
- Class III @ 1KHz and .5 VRMS
- Dissipation Factor:
- @ 25°C
- Class I: .15% max
- Class II: 2.5% max
- Class III: 3.0% max
- Insulation Resistance:
- Per MIL-STD-202
- Class I & II lesser of 100KmΩ/1000mΩ-μF
- @125 °C, lesser of 10KmΩ/100mΩ-μF
- Class III: lesser of 10KmΩ/ 100m Ω-μF
- @125°C, lesser of 1KmΩ/ 10mΩ-μF
- Dielectric Withstand Voltage (Flash Test):
- Per MIL-STD-202, Method 301, 5sec,
- <10mA <500 VDC: 250% rated voltage
- 500 VDC to 1KV: 150% rated voltage
- >1KV: 120% rated voltage to be tested in a non-corrosive fluid.
- Body Insulation:
- 1000VDC per MIL-PRF-49467
- Partial Discharge:
- (Corona) per MIL-PRF-49467
Environmental
(Non-Standard Testing)
- Thermal Shock:
- Method 107 of MIL-STD-202 and MIL-PRF-49467
- Voltage Conditioning:
- 96 Hours minimum at 125°C per MIL-PRF-49467
- Low Temperature Storage:
- 8 hours at -65°C
- Solderability:
- MIL-STD-202, Method 208 except Sn 62 for chips
- Voltage Temperature Characteristic:
- Per para 4.8.10, MIL-PRF-49467
- Vibration (High Frequency):
- Method 204 of MIL-STD-202., Condition D (20 G's)
- Immersion Cycling:
- Method 104 of MIL-STD-202, Test Condition B
- Shock:
- Method 213 of MIL-STD-202, Test Condition 1 (100 G's)
- Terminal Strength:
- Method 211 per MIL-STD-202, Test Condition A (5 lbs.)
- Resistance to Solder Heat:
- Method 210 of MIL-STD‑ 202, Test Condition C and MIL-PRF-49467
- Moisture Resistance:
- Method 106 of MIL-STD-202 and MIL-PRF-49467.
- Fungus:
- Method 508 of MIL-STD-202
- Resistance to Solvents:
- Method 215 of MIL-STD-202
- Life Test:
- Class I and II @ 125°C, Class III @ 85°C per MIL-PRF-49467 Para 4.8.18
- Group A Inspection:
- As required by contract or specification. (MIL-PRF-49467 STD)
- Group B Inspection:
- As required by contract specification (MIL-PRF-49467 STD)
- Barometric Pressure:
- MIL-STD-202, Method 106, Condition E
- Reference Documents:
- MIL-PRF-49467-Leaded
- MIL-PRF-55681 -Chips
- MIL-STD-202-Testing
- EIA RS469-Ceramic Capacitor
Other testing available, consult factory.
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